Wire Bonding Tutorial
Sophie Turner 

Wire Bonding Tutorial


The wire bonder uses a conductive wire to make connections between the IC and DIP. There are two common methods to make connections: ball bonding and wedge bonding. Ultrasonic power, force, and heat are used for the ball bonding method and it requires temperatures between 100 deg C and 500 deg C [2,3]. Wedge bonding process uses ultrasonic bonding process that happens at room temperature [2]. Silver wire and gold wire are common conductive wires and were included with the tpt HB05 wire bonder. Wedge bonding can be manufactured at small dimensions which is an advantage over ball bonding [1-3].

For more information about the tpt wire bonder or the process go here to their website

Read the manual first.
This is an extra resource for if you are running into trouble with adjustments and settings.
Find what is comfortable and practice.

Wire Bonding Set Up
To set up the wire bonder follow the HB05 manual.
tpt has other videos and information as well as a representative to reach out to if help is needed.

To thread the wire for ball bounding and wedge bounding watch the videos below.

Threading Capillary Tool

Threading Wedge Tool

Microscope Adjustments

The EOF is needed to create the ball for ball bounding. Read the manual to learn more about the EOF. If the EOF is not being activated, then use the video below to adjust the EOF.

Wire Bonding Tips

Other Tips


[1] “Bonding wire,” Bonding Wire - an overview | ScienceDirect Topics. [Online]. Available: 

https://www.sciencedirect.com/topics/engineering/bonding-wire. [Accessed: 26-Sep-2021].

[2]  “Chapter A: Wire Bonding,” Research Service Centers Herbert Wertheim College of Engineering. [Online]. 

Available: https://rsc.aux.eng.ufl.edu/_files/documents/3201.pdf. [Accessed: 26-Sep-2021].

[3] Franz Hickmann. Wire Bonding Basics.