ENGR 351 HW 3
Part 2
Name: Zane Sauer

Email: zmsauer@fortlewis.edu

Part 2:
Creating TLV751


Figure 1: Footprint of TLB 751


Figure 2: Connected device of TLV751


Figure 3: Footprint of 100uF Capasitor


Figure 4: Connected device of 100uF Cap


Figure 5: Schematic view of final board. Note that there were 2 ERC warnings and no errors and no DRC errors. I beleive that the ERC warnings could be ignored.


Figure 6: Board View with routing and no fill


Figure 7: Board with ratsnest.


Gerber Files