ENGR 351 HW 3
Part 2
Name: Zane Sauer
Email:
zmsauer@fortlewis.edu
Part 2:
Creating TLV751
Figure
1: Footprint of TLB 751
Figure 2: Connected device of TLV751
Figure 3: Footprint of 100uF Capasitor
Figure 4: Connected device of 100uF Cap
Figure 5: Schematic view of final board. Note that there were 2 ERC
warnings and no errors and no DRC errors. I beleive that the ERC
warnings could be ignored.
Figure 6: Board View with routing and no fill
Figure 7: Board with ratsnest.
Gerber Files